SOLDERING & SURFACE MOUNT TECHNOLOGY

期刊名

SOLDERING & SURFACE MOUNT TECHNOLOGY

SOLDER SURF MT TECH

ISSN / eISSN

0954-0911

目标和范围

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.

研究方向

冶金工程

工程：电子与电气

工程：制造

CiteScore

4.10 查看趋势图

CiteScore 学科排名

类别	分区	排名
Engineering - Electrical and Electronic Engineering	Q2	#316/797
Engineering - Condensed Matter Physics	Q2	#175/434
Engineering - General Materials Science	Q2	#227/463

Web of Science 核心收藏夹

Science Citation Index Expanded (SCIE)	Social Sciences Citation Index (SSCI)
Indexed	-

类别 (Journal Citation Reports 2024)	分区
ENGINEERING, ELECTRICAL & ELECTRONIC	Q3
ENGINEERING, MANUFACTURING	Q4
MATERIALS SCIENCE, MULTIDISCIPLINARY	Q3
METALLURGY & METALLURGICAL ENGINEERING	Q2

H-index

28

出版国家或地区

ENGLAND

出版商

Emerald Group Publishing Ltd.

出版周期

Quarterly

年文章数

22

Open Access

NO

通讯方式

EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA