Related references
Note: Only part of the references are listed.Influence of Number of Functional Groups of Hyperbranched Polyol on Cure Kinetics and Physical Properties of Polyurethanes
Pradip K. Maji et al.
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY (2009)
Cure kinetics, dynamic mechanical and morphological properties of epoxy resin-IM6NiBr2 system
Abdollah Omrani et al.
EUROPEAN POLYMER JOURNAL (2008)
Crosslinking of mixtures of DGEBA with 1,6-dioxaspiro[4,4]nonan-2,7-dione initiated by tertiary amines.: I.: Study of the reaction and kinetic analysis
Xavier Fernandez-Francos et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2008)
Isothermal differential scanning calorimetry study of the cure kinetics of a novel aromatic maleimide with an acetylene terminal
Zhenhua Luo et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2008)
Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC
Hongyang Cai et al.
THERMOCHIMICA ACTA (2008)
Integrated measurement technique for curing process-dependent mechanical properties of polymeric materials using fiber bragg grating
Y. Wang et al.
EXPERIMENTAL MECHANICS (2008)
Curing behavior study of polydimethylsiloxane-modified allylated novolac/4,4′-bismaleimidodiphenylmethane resin
Wanwan Li et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2008)
Thermo-optical modeling of polymer fiber Bragg grating illuminated by light emitting diode
Kyoung Joon Kim et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2007)
Kinetic analysis by DSC of the cationic curing of mixtures of DGEBA and 6,6-dimethyl (4,8-dioxaspiro[2.5]octane-5,7-dione)
Lidia Gonzalez et al.
THERMOCHIMICA ACTA (2007)
Gelation and isoconversional kinetic analysis of lignin-phenol-formaldehyde resol resins cure
M. V. Alonso et al.
CHEMICAL ENGINEERING JOURNAL (2006)
Prediction of mechanical stresses induced by flip-chip underfill encapsulants during cure
MHH Meuwissen et al.
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES (2006)
Monitoring of cure kinetic prepreg and cure cycle modeling
M. L. Costa et al.
JOURNAL OF MATERIALS SCIENCE (2006)
Time-temperature transformation (TTT) cure diagram of a fast cure non-conductive adhesive
H Yu et al.
THIN SOLID FILMS (2006)
Creep behavior of carbon fiber/epoxy matrix composites.
WK Goertzen et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
On the characterization of tensile creep resistance of polyamide 66 nanocomposites. Part I. Experimental results and general discussions
JL Yang et al.
POLYMER (2006)
Effects of underfill materials on the reliability of low-K flip-chip packaging
KM Chen et al.
MICROELECTRONICS RELIABILITY (2006)
Observations of gelation and vitrification of a thermosetting resin during the evolution of polymerization shrinkage
H Yu et al.
MACROMOLECULAR RAPID COMMUNICATIONS (2005)
Cure shrinkage measurement of nonconductive adhesives by means of a thermomechanical analyzer
H Yu et al.
JOURNAL OF ELECTRONIC MATERIALS (2005)
Experiment and numerical analysis of the residual stresses in underfill resins for flip chip package applications
ML Sham et al.
JOURNAL OF ELECTRONIC PACKAGING (2005)
Chemical and diffusion-controlled curing kinetics of an underfill material
Y He
MICROELECTRONICS RELIABILITY (2005)
In-situ measurement of chemical shrinkage of MY750 epoxy resin by a novel gravimetric method
C Li et al.
COMPOSITES SCIENCE AND TECHNOLOGY (2004)
Modeling of the curing kinetics of no-flow underfill in flip-chip applications
ZQ Zhang et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2004)
Cure kinetics, gelation, and glass transition of a bisphenol F epoxide
DJ O'Brien et al.
POLYMER ENGINEERING AND SCIENCE (2003)
Optical measurements of shrinkage in UV-cured adhesives
AJ Hudson et al.
JOURNAL OF ELECTRONIC PACKAGING (2002)
Contraction stress related to degree of conversion and reaction kinetics
RR Braga et al.
JOURNAL OF DENTAL RESEARCH (2002)
Cure shrinkage analysis of epoxy molding compound
K Oota et al.
POLYMER ENGINEERING AND SCIENCE (2001)
High-sensitivity pressure sensor using a shielded polymer-coated fiber Bragg grating
Y Zhang et al.
IEEE PHOTONICS TECHNOLOGY LETTERS (2001)
Simultaneous measurement of polymerization kinetics and stress development in radiation-cured coatings: A new experimental approach and relationship between the degree of conversion and stress
AA Stolov et al.
MACROMOLECULES (2000)
Analysis of induced-birefringence effects on fiber Bragg gratings
R Gafsi et al.
OPTICAL FIBER TECHNOLOGY (2000)
Time-cure-temperature superposition for the prediction of instantaneous viscoelastic properties during cure
Y Eom et al.
POLYMER ENGINEERING AND SCIENCE (2000)
Internal strain measurement by fiber Bragg grating sensors in textile composites
XM Tao et al.
COMPOSITES SCIENCE AND TECHNOLOGY (2000)