Thermal conductivity and water vapour transmission properties of wood-based materials

For several wood-based materials (plywood, OSB, melamine faced board (MFB), particle board and fibre board), the thermal conductivity was determined as a function of the temperature (ranging between 10 and 30 A degrees C) and also the moisture content (from an oven-dry sample up to a moisture content at 80% RH). Furthermore, the water vapour resistance factor of these materials as well as of the coating (at MFB) and the diffusion coefficient were determined under dry cup (performance at low humidity dominated by vapour diffusion) and wet cup (performance at high humidity with liquid water and vapour transport) conditions. Thermal conductivity increases with rising temperature, moisture content and density. Moreover, a clear decrease of thermal conductivity was found with decreasing particle size at the same density level, from solid wood over plywood and particle board to fibre board. The water vapour resistance factor of the wood-based materials increases with rising density and decreases with increasing moisture content. An influence of the particle and fibre board thickness was also revealed. In contrast to the remaining materials, an increase of the water vapour resistance factor with increasing moisture content was measured for the coating. The diffusion coefficient decreases with rising density and moisture content.