Related references
Note: Only part of the references are listed.
Article
Engineering, Chemical
Development and characterization of a wood adhesive using bagasse lignin
MA Khan et al.
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES (2004)
Article
Engineering, Chemical
Use of organosolv lignin in phenol-formaldehyde resins for particleboard production -: I.: Organosolv lignin modified resins
NS Çetin et al.
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES (2002)
Share Paper
