Journal
ETRI JOURNAL
Volume 33, Issue 4, Pages 637-640Publisher
WILEY
DOI: 10.4218/etrij.11.0210.0298
Keywords
Maskless bumping; solder-on-pad (SoP) technology; Sn3Ag0.5Cu solder; resin
Funding
- MKE/KEIT [K1002134, 10037039]
- Korea Evaluation Institute of Industrial Technology (KEIT) [K1002134, KI002134, 10037039] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump am ray was successfully formed with pitch of 150 mu m in one direction.
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