Journal
ENERGY & ENVIRONMENTAL SCIENCE
Volume 7, Issue 8, Pages 2619-2623Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c4ee01138d
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Funding
- Directorate For Engineering
- Div Of Chem, Bioeng, Env, & Transp Sys [1437656] Funding Source: National Science Foundation
- Directorate For Engineering
- Div Of Electrical, Commun & Cyber Sys [1252623] Funding Source: National Science Foundation
- Division Of Materials Research
- Direct For Mathematical & Physical Scien [1303742] Funding Source: National Science Foundation
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We report on an interdiffusion method to fabricate pin-hole free perovskite films using a low temperature (<105 degrees C) solution process. A high efficiency of 15.4%, with a fill factor of similar to 80%, was achieved for the devices under one sun illumination. The interdiffusion method results in high device yield, with an efficiency of above 14.5% for more than 85% of the devices.
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