Journal
ELECTRONIC MATERIALS LETTERS
Volume 10, Issue 3, Pages 645-647Publisher
KOREAN INST METALS MATERIALS
DOI: 10.1007/s13391-014-3190-y
Keywords
fatigue life; QFP device; solder joints; thermal cycling loading
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Funding
- Natural Science Foundation of Jiangsu Province [BK2012144]
- Natural Science Foundation of the Higher Education Institutions of Jiangsu Province [12KJB460005]
- Jiangsu Normal University Foundation [11XLR16]
- Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation [JSAWS-11-03]
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Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.
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