Related references
Note: Only part of the references are listed.Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System
C. E. Ho et al.
JOURNAL OF ELECTRONIC MATERIALS (2012)
Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn-Pd/Ni system
Cheng-En Ho et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2011)
On the root cause of Kirkendall voiding in Cu3Sn
Liang Yin et al.
JOURNAL OF MATERIALS RESEARCH (2011)
Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System
A. Paul et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2011)
Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn-4.0Ag-0.5Cu and Cu-Zn Substrate
Young Min Kim et al.
ELECTRONIC MATERIALS LETTERS (2010)
Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure
S. P. Peng et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2010)
Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders
Y. W. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2010)
Effects of Ag on the Kirkendall void formation of Sn-xAg/Cu solder joints
Sunghwan Kim et al.
JOURNAL OF APPLIED PHYSICS (2010)
Strong effect of Pd concentration on the soldering reaction between Ni and Sn-Pd alloys
Cheng En Ho et al.
JOURNAL OF MATERIALS RESEARCH (2010)
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
T. Laurila et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2010)
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints
J. Y. Kim et al.
ACTA MATERIALIA (2009)
Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth
Y. W. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
Y. W. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers
T. Laurila et al.
MICROELECTRONICS RELIABILITY (2009)
Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints
Jin Yu et al.
ACTA MATERIALIA (2008)
Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad
Y. K. Jee et al.
JOURNAL OF MATERIALS RESEARCH (2007)
Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu
S. C. Yang et al.
JOURNAL OF MATERIALS RESEARCH (2006)
Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
Feng-Jiang Wang et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing
F Gao et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
SK Kang et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints
IE Anderson et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition
FJ Wang et al.
SCRIPTA MATERIALIA (2005)
Interfacial reactions between lead-free solders and common base materials
T Laurila et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2005)
Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength
IE Anderson et al.
JOURNAL OF ELECTRONIC MATERIALS (2004)
A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni
JY Tsai et al.
JOURNAL OF ELECTRONIC MATERIALS (2003)
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
K Zeng et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2002)
Share Paper
