Journal
ELECTRONIC MATERIALS LETTERS
Volume 6, Issue 1, Pages 35-39Publisher
KOREAN INST METALS MATERIALS
DOI: 10.3365/eml.2010.03.035
Keywords
dry etching; plasma; ICP; Germanium
Categories
Funding
- Ministry of Education. Science and Technology [2009-0094033]
- National Research Foundation of Korea [2009-0094033] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
Ask authors/readers for more resources
In this study, the etch characteristics of Ge are investigated using inductively coupled Ar/CCl2F2/Cl-2 plasmas. The etch rate, surface morphology and subtended angle obtained with different etching conditions are presented. The etch rate of Ge increases from 374 angstrom/min to 520 angstrom/min as the ICP power increases from 400 to 700 W. whereas the etching rate of Ge decreases from 524 angstrom/min to 400 angstrom/min as CCl2F2 flow increases from 40 seem to 80 seem. In addition, the etching rate of Ge decreases from 467 angstrom/min to 400 angstrom/min as the Cl-2 flow increases from 0 seem to 20 seem. As the ICP power increases the subtended angle also increases. According to SEM imagery Ar/CCl2F2/Cl-2 ICP etching leads to the presence of carbon-based material in the form of large particles.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available