4.6 Article

A rapid one-step process for fabrication of superhydrophobic surface by electrodeposition method

Journal

ELECTROCHIMICA ACTA
Volume 59, Issue -, Pages 168-171

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.electacta.2011.10.045

Keywords

Superhydrophobic; Electrodeposition; Copper surfaces; Myristic acid; Contact angle

Funding

  1. National Natural Science Foundation of China [50331040, 60171034, 11102164]
  2. Northwestern Polytechnical University, China [G9KY101502]

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Superhydrophobic surfaces are commonly prepared by a combination of low surface energy materials and micro/nano structures. In this work, a rapid one-step electrodepositing process is developed to fabricate superhydrophobic cathodic surface by copper plate in an electrolytic solution containing nickel chloride(NiCl2 center dot 6H(2)O), myristic acid and ethanol. Scanning electron microscopy (SEM) images, Fourier-transform infrared (FTIR) spectrometer, X-ray diffraction (XRD) and contact angle measurement have been performed to characterize the morphological features, chemical composition and superhydrophobicity property. The results demonstrate that the micro/nano scales cauliflower-like structure are composed of Ni crystals and Ni[CH3(CH2)(12)COO](2) crystals. The maximum contact angle is about 164 and rolling angle is less than 2 degrees. The needed electrolytic time is largely shortened to 1 min. This method is rapid, easy and effective, and it will have great prospects for industrial applications. (C) 2011 Elsevier Ltd. All rights reserved.

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