Journal
ELECTROCHIMICA ACTA
Volume 55, Issue 5, Pages 1825-1828Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.electacta.2009.10.074
Keywords
Sn anode; Cu anode; Electroplating; High-voltage irreversible capacity; Li-ion battery
Categories
Funding
- Growth Engine Technology Development Program [10016472]
- Korea Ministry of Knowledge Economy
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An electroplated copper/tin (Cu/Sn) anode with a layered structure is described that minimizes the high-voltage irreversible capacity observed in an electroplated Sn anode at a potential over 1V. The high-voltage irreversible capacity is caused by the electrolyte decomposition at the catalytic site of the Sn anode. In the electroplated Cu/Sn anode, the upper Cu layer effectively suppresses the exposure of the newly formed Sn surfaces, resulting in the absence of the high-voltage irreversible capacity. Therefore. the electroplated Cu/Sn anode exhibits a higher cycle performance than the electroplated Sn anode. (C) 2009 Elsevier Ltd. All rights reserved.
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