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Pulse and pulse reverse plating - Conceptual, advantages and applications

Journal

ELECTROCHIMICA ACTA
Volume 53, Issue 8, Pages 3313-3322

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.electacta.2007.11.054

Keywords

pulse current (PC) electrodeposition; pulse reverse current (PRC); individual metals and their alloys; composites and semiconductor; applications

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A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and alloys are reported. The effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and morphology are presented. Applications, advantages and disadvantages of PC and PRC techniques are discussed along with theoretical aspects and mechanism. (C) 2007 Elsevier Ltd. All rights reserved.

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