Journal
ELECTROCHEMISTRY COMMUNICATIONS
Volume 33, Issue -, Pages 119-122Publisher
ELSEVIER SCIENCE INC
DOI: 10.1016/j.elecom.2013.04.031
Keywords
Electrochemical wet stamping technique; 3D micromachining; MEMS; Aluminum; Anodic dissolution
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Funding
- Natural Science Foundation of China [21263017, 91023047, 91023006, 91023043, 21021002]
- Industry Support Plan of Jiangxi Province of China [20111BBE50024]
- Foundation of National Defense Key Discipline Lab. of Light Alloys Machining
- Natural Science Foundation of Fujian Province of China [2012J06004]
- Fundamental Research Funds for the Central Universities [2010121022]
- Program for New Century Excellent Talents in University [NCET-12-0318]
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We proposed an up-down working mode of electrochemical wet stamping technique (EC-WETS) for three dimensional (3D) micromachining on aluminum (Al) surface. 3D microstructures on a Si mold were transferred on to an agarose hydrogel containing 15% NaNO3, 2% MgF2, 1% NaOH and 5% glycerin, which acted as the quasi-solid electrolyte for the electrochemical micromachining. The transferred 3D microstructures on agarose hydrogel were then duplicated onto Al surface through anodic dissolution. The micromachining quality was improved by pulse-potential method dramatically with a machining tolerance lower than 200 nm and an average removal rate of 210 nm min(-1) in the Z direction. This method was proved to be a highly efficient low cost and green method for 3D micromachining on active metal surface, which would be valuable for the manufacture of microelectromechanical system (MEMS). (c) 2013 Elsevier B.V. All rights reserved.
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