Journal
ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume 14, Issue 9, Pages H358-H361Publisher
ELECTROCHEMICAL SOC INC
DOI: 10.1149/1.3597656
Keywords
coatings; electrochemical impedance spectroscopy; scanning electron microscopy; sputter etching; surface cleaning; thin films; X-ray photoelectron spectra
Funding
- SRC/Sematech Engineering Research Center at The University of Arizona [2001-MC-425]
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A liquid mixture formed from two benign chemicals, urea and choline chloride, in the molar ratio of 2:1 has been evaluated for post etch residue (PER) removal from copper surface. Residue films were prepared by etching DUV photoresist films coated on copper in CF4/O-2 plasma. Film removal was evaluated under immersion cleaning conditions using X-ray photoelectron spectroscopy and scanning electron microscopy and verified using electrochemical impedance spectroscopy measurements. The residue film was effectively removed in the temperature range of 40-70 degrees C. The results of this study show that choline chloride and urea based DES system has the potential to function as a back end of line cleaning formulation. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3597656] All rights reserved.
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