Journal
CURRENT APPLIED PHYSICS
Volume 12, Issue 2, Pages 473-478Publisher
ELSEVIER
DOI: 10.1016/j.cap.2011.08.003
Keywords
Copper ink; Metal film; Low temperature curing; RFID antenna
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We have synthesized nano-sized copper hydroxide powder and copper (II) neodecanoate complex that can be decomposed to form copper metal films. Copper conductive ink was then prepared by mixing the powder and complex with a binder in terpineol. The lowest resistivity of 12.5 mu Omega cm and 5B level of adhesion strength were obtained with 5% addition of epoxy resin as a binder. The copper ink was then applied to fabricate a loop-type RFID antenna tag and the performance of the antenna was compared with that of conventional copper-etched and silver-paste antenna. The fabricated RFID antenna showed comparable performance to the conventional RFID antenna. (C) 2011 Elsevier B. V. All rights reserved.
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