Journal
CORROSION SCIENCE
Volume 63, Issue -, Pages 20-28Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.corsci.2012.05.006
Keywords
Electronic materials; Alloy; SEM; XPS; Atmospheric corrosion
Funding
- Nature Science Foundation [51025104]
- State Key Laboratory of Environment Adaptability for Industrial Products, China National Electric Apparatus Research Institute, Guangzhou
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The aim of this study is to evaluate the effects of Ag3Sn intermetallic compounds (IMCs) on corrosion of Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The Ag3Sn IMCs of SAC305 with various size and morphology were obtained by changing cooling rate. Commercial SAC305 solder with smallest Ag3Sn IMCs exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders because microgalvanic corrosion between large cathodic Ag3Sn IMCs plates and anodic Sn matrix decreased the corrosion resistance of air-cooled and furnace-cooled SAC305 solders. (c) 2012 Elsevier Ltd. All rights reserved.
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