Laboratory scale investigation into the corrosion of copper in a sulphur-containing environment

The effect of temperature and gas composition on the corrosion rate and corrosion by-product of copper foil was studied by exposing it to sulphur (S-2), S-2 + hydrochloric acid (HCl) and hydrogen sulphide. The temperature was varied from 80 to 140 degrees C. Copper foil reacted with S-2 to form CuS, Cu9S8 and Cu1.8S. Corrosion rates ranged from 9.6 mu m/h at 110 degrees C to 0.5 mu m/h at 140 degrees C. The presence of HCl caused pitting and enhanced the corrosion rate above 112 degrees C. Cu2S formed when copper was exposed to hydrogen sulphide gas. Sulphide scale that formed was friable and non-adherent. (C) 2011 Elsevier Ltd. All rights reserved.