Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 24, Issue 5, Pages 1409-1414Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2015.2406878
Keywords
3D etch; silicon micro-structure; deep reactive ion etching; dual-angle; gray-scale e-beam lithography
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Funding
- Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, USA
- National Aeronautics and Space Administration [105571]
- U.S. Government Sponsorship
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Fabrication of 3-D microstructures is one of the most challenging aspects of silicon micromachining. In this paper, we present a novel microfabrication method using one single-step deep reactive ion etching process with gray-scale e-beam lithography mask that offers deeply etched (>350-mu m deep) dual-angle 3-D microneedles with control over the height and shape of the structures. Moreover, we found that the shape of the e-beam lithography patterns can determine the general configuration and features of the final etched microneedles, and that the etching process parameters have the most impact on the microneedles' shape, such as size and vertical base angle. Large arrays of 20 x 20 microneedles with height uniformity of better than 3% are fabricated. [2014-0209]
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