Journal
COMPOSITES PART B-ENGINEERING
Volume 42, Issue 6, Pages 1468-1473Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesb.2011.04.045
Keywords
Laminates; Microstructures; Interface; Mechanical properties; Heat treatment
Funding
- National Basic Research Program (973 Program) of China [2009CB930004]
- National High Technology Research and Development Program (863 program) of China [2011AA030104]
- Science and Technology Research Foundation of Shenzhen Bureau of Science and Technology Information [JC200903170498A]
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A copper/aluminum/copper sandwich clad sheet was fabricated by means of cold rolling process and heat treated with different temperature and time. The Al/Cu interface and its bond strength were investigated by SEM. TEM and peeling test. The results reveal that low temperature heat treatment can improve the morphology of Al/Cu interface and increase its bond strength. However high temperature and long time result in the formation of Al(2)Cu intermetallic compound layer, which is detrimental to the bond strength, and moreover, small Al(2)O(3) particles precipitate along the Al(2)Cu and Al interface. When the interlayer along Al/Cu interface grows to a certain thickness, the effect of heat treatment temperature and time become weak. For the present study, the reasonable heat treatment may be 423 K and 20 h. (C) 2011 Elsevier Ltd. All rights reserved.
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