Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 43, Issue 3, Pages 325-332Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2011.12.003
Keywords
Polymer-matrix composites (PMCs); Debonding; Interface; Micro-mechanics
Funding
- National Natural Science Foundation of China [50803045]
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Microcapsules containing phase change materials (microPCMs) can be filled in polymeric matrix forming smart temperature-controlling composites. The aim of this study was to investigate the effect of interface debonding on the thermal conductivity of microPCMs containing paraffin/epoxy composites. The shell thickness and average size of microPCMs were controlled by regulating the core/shell ratios and emulsion stirring rates. Test results indicated that the thermal conductivity (K-e) of all composites decreased after a thermal shock treatment. SEM and thermography measurements were applied to observe the interface behaviors of composites after a violent thermal treatment process. It was proved that the interface debonding was generated because of the mismatch of expansion coefficient between shell and epoxy. A modeling analysis of the relative thermal conductivity (K-r) indicated that the effective approach to decrease the debonding is to enhance the molecule tangling degree between shell and matrix. (C) 2011 Elsevier Ltd. All rights reserved.
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