4.3 Article

Investigation of thermoplastic hot embossing process using soft polydimethylsiloxane (PDMS) micromold

Journal

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
Volume 29, Issue 12, Pages 5063-5067

Publisher

KOREAN SOC MECHANICAL ENGINEERS
DOI: 10.1007/s12206-015-1102-1

Keywords

Hot embossing; Micromold; Mold deformation; Polydimethylsiloxane; Thermoplastic

Funding

  1. International Collaborative R&D Program through the Korea Institute for the Advancement of Technology (KIAT) - Ministry of Trade, Industry and Energy [N0000894]
  2. Basic Science Research Program through the National Research Foundation of Korea (NRF) - Ministry of Science, ICT & Future Planning [NRF-2014R1A1A1008487]

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A hot embossing process using a soft polydimethylsiloxane (PDMS) micromold was experimentally investigated. Although the PDMS micromold shows several advantages, including short fabrication time, high flexibility, and easy modification of surface properties, a mold deformation during the embossing process is inevitable because of its low Young's modulus. In this regard, hot embossing experiments were systematically carried out to investigate the effect of major processing parameters on the soft micromold deformation. By measuring characteristic geometrical dimensions of the replicated microfeatures from the deformed microcavity, the deformation behavior of the soft micromold was analyzed.

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