Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 26, Issue 7, Pages 5106-5112Publisher
SPRINGER
DOI: 10.1007/s10854-015-3037-9
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Funding
- project SI I&DT Projeto em co-promocao [36265/2013, HMIEXCEL-2013-2015]
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The wettability between solder and substrate is a very important issue in reliability of soldering process. The contact angle theta is used to measure the degree of wetting. The contact angle of lead-free alloy Sn-3 % Ag-0.5 % Cu (wt%) was measured, as a function of temperature, for three different commercial surface finish substrates used in printed circuit boards (PCB): Sn, NiAu and Organic Solderability Preservative (OSP). The measurements were performed by the sessile drop method in two different atmospheres: high vacuum and inert gas. In high vacuum the results showed that on substrates of NiAu and OSP the solder started spreading suddenly at 225 degrees C and in Sn substrate the contact angle decreases slightly with temperature. In inert gas atmosphere the results showed different behaviours: the contact angle between molten solder in OSP and NiAu substrates is sensitive to temperature; and, in Sn substrate, the contact angle does not change with temperature. The NiAu and OSP substrates showed a better degree of wettability than Sn substrate, in inert atmosphere.
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