Cathodic deposition of copper on polyaniline-coated textiles from a citrate bath: effects of electroplating conditions

Copper electrodepostion on polyaniline (PANI)-covered poly(ethylene terephthalate) (PET) textiles was realized galvanostaticly in a plating solution containing sodium citrate. Electrochemical behaviors of Cu deposition on PANI/PET electrodes in citrate baths were studied by measuring the cathodic polarization curves. Electroplating conditions such as concentrations of copper sulfate, sodium citrate and sodium sulfate, pH value, current density as well as the concentration ratio of oxidation/monomer for PANI formation were determined by comparing the polarization curves and the current efficiency results. The surface morphologies of Cu/PANI/PET formed under the different current density were evidenced by scanning electron microscopy. In addition, the conductivity of the synthesized films was also measured with a four-probe method and the lowest sheet resistance of 100 m Omega/sq was presented at 60-80 mA cm(-2), in which the maximum current efficiency reached up to 85 %. The deposition mechanism that the reductions of copper ions and PANI layers occurred in parallel, and the growth of copper crystals performed at the polymer surface were deduced.