Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 215, Issue -, Pages 6-11Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2014.08.007
Keywords
Lead-free solder; Laser soldering process; Intermetallic compound formation; Impact reliability; Isothermal aging
Funding
- JSPS KAKENHI Grant [22560721]
- Grants-in-Aid for Scientific Research [22560721] Funding Source: KAKEN
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The formation and growth of an intermetallic compound (IMC) layer at the Sn-Ag-Cu solder/Cu interface after laser soldering and during isothermal aging were investigated to elucidate the basic characteristics of the laser soldering process. The impact reliability of joints soldered using the laser process was also examined. It was found that, in the as-soldered condition, a relatively thin IMC layer is formed at the interface of the joints soldered by the laser process. The impact reliability of the joints soldered by the laser process at 20W for 40s was superior to that of the joints soldered by the conventional reflow process. (C) 2014 Elsevier B.V. All rights reserved.
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