4.5 Article

Three-Dimensional Crystal Plasticity Finite Element Simulation of Hot Compressive Deformation Behaviors of 7075 Al Alloy

Journal

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
Volume 24, Issue 3, Pages 1294-1304

Publisher

SPRINGER
DOI: 10.1007/s11665-015-1395-3

Keywords

alloy; crystal plasticity; hot deformation; microstructural evolution; representative volume element

Funding

  1. China Scholarship Council (CSC) [201206370113]
  2. National Natural Science Foundation of China [51375502]
  3. National Key Basic Research Program [2013CB035801]
  4. Australian Research Council (ARC) Centre of Excellence for Design in Light Metals [CE0561574]

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Three-dimensional crystal plasticity finite element (CPFE) method is used to investigate the hot compressive deformation behaviors of 7075 aluminum alloy. Based on the grain morphology and crystallographic texture of 7075 aluminum alloy, the microstructure-based representative volume element (RVE) model was established by the pole figure inversion approach. In order to study the macroscopic stress-strain response and microstructural evolution, the CPFE simulations are performed on the established microstructure-based RVE model. It is found that the simulated stress-strain curves and deformation texture well agree with the measured results of 7075 aluminum alloy. With the increasing deformation degree, the remained initial weak Goss texture component tends to be strong and stable, which may result in the steady flow stress. The grain orientation and grain misorientation have significant effects on the deformation heterogeneity during hot compressive deformation. In the rolling-normal plane, the continuity of strain and misorientation can maintain across the low-angle grain boundaries, while the discontinuity of strain and misorientation is observed at the high-angle grain boundaries. The simulated results demonstrate that the developed CPFE model can well describe the hot compressive deformation behaviors of 7075 aluminum alloy under elevated temperatures.

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