Grinding of silicon and glass using a new dressing device and an improved coolant system

Ductile mode machining of brittle materials such as ceramics is recognized as an emerging technology with important applications. Ductile machining is possible if the depth of cut is less than the critical depth of cut of the machined material. By using a new device for dressing a resin-bonded diamond wheel and an improved coolant system proposed here, ductile mode grinding of silicon and glass was achieved using an inexpensive, conventional surface-grinding machine. The low-cost dressing device also ensured minimum disruption to the grinding operation and a higher level of safety. A flooding supply of coolant at the grinding zone provided better cooling performance and lubrication. A relationship appeared to exist between the surface finish and the lightness values of ground silicon surfaces.