Journal
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
Volume 24, Issue 1, Pages 18-25Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/6104.924788
Keywords
die-attach; die-coat; MEMS packaging; micromachined accelerometer; sensor and actuator; stress and strain
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A packaging study of an acceleration microelectromechanical systems (MEMS) sensor is presented. The sensor consists of two silicon chips: a surface micromachined capacitive transducer (g-cell), which converts acceleration into signal of capacitance variation, and a microprocessor control unit (MCU) for signal conditioning, The two chips are die-bonded into a single piece of leadframe, connected via wire bonding, and finally molded with an epoxy compound, The primary goals of this paper are to provide insight and guidance for designing a package with low stress and low deformation, In particular, two die-bonding schemes: full die attach and four-dot die attach are presented in detail and their impact on performance of the transducer is discussed. Both the numerical simulation and testing data indicated that the four-dot die-attach process results in a significantly lower packaging stress to the transducer, and is appropriate for stress-sensitive MEMS devices.
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