Journal
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume 25, Issue 1, Pages 3-14Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/6144.991169
Keywords
creep of solders; flip chip; microvias; FCB; reliability; solder joint; WLCSP
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The creep analyses of solder-bumped wafer level chip scale package (WLCSP) on build-up printed circuit board (PCB) with microvias subjected to thermal cyclic loading are presented. The emphasis of this study Is placed on the effects of the thickness of the PCB with a microvia build-up layer on the solder joint reliability of the WLCSP assembly. The 62Sn-2Ag-36Pb solder joints are assumed to follow the Garofalo-Arrhenius creep constitutive law. The shear stress and creep shear strain hysteresis loops, shear stress range, creep shear strain range, and creep strain energy density range at different locations in the corner solder joint are presented for a better understanding of the thermaI-mechanical behaviors of the solder-bumped WLCSP on build-up PCB with microvias. It is found that, due to the large coefficient of thermal expansion of the build-up resin, the effects of thickness of the PCB with microvia build-up layer become much more significant than that without the microvia build-up layer.
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