Investigation of scratching sequence influence on material removal mechanism of glass-ceramics by the multiple scratch tests

The existing research on grinding mechanism by single scratch method cannot reflect the interaction among multiple scratches caused by the stochastic distribution of numerous grits on the grinding wheel surface. To clarify the effect of multi-scratch interaction on material removal mechanism during grinding of glass-ceramics, a multi-scratch experiment with different scratching sequences was conducted on glass-ceramics using a nanoindenter in this paper. A model of multi-scratch stress field is established to analyze the material removal mechanism such as surface morphology, material deformation, crack propagation and chip removal strength. The results show that successive scratching sequence promotes to the severe crack propagation of glass-ceramics due to its higher maximum principal stress whereas non-successive scratching sequence is prone to result in chip removal owing to its deeper stagnation region. These findings provide critical insight of grinding mechanics for glass-ceramics components by considering the interactions among multiple scratches.