Journal
CHEMISTRY OF MATERIALS
Volume 14, Issue 3, Pages 949-+Publisher
AMER CHEMICAL SOC
DOI: 10.1021/cm010639h
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A slight change in the Cu concentration in the Sn-Ag-Cu solders can make a big difference in the strength of a solder joint in microelectronic packages. It was shown that (Ni1-xCux)(3)Sn-4 formed at the interface when Sn-3.9Ag-0.2Cu (wt%) solder was reacted with Ni and (Cu1-yNiy)(6)Sn-5 formed when Sn-3.9Ag-0.6Cu was reacted with Ni. The industry therefore must impose a very strict control over the Cu concentration to produce the desired intermetallic compound.
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