Journal
JOURNAL OF MATERIALS RESEARCH
Volume 17, Issue 3, Pages 597-599Publisher
MATERIALS RESEARCH SOCIETY
DOI: 10.1557/JMR.2002.0084
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The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu,Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson's parameter alpha was explained. The Jackson's parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.
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