Journal
MICRON
Volume 34, Issue 2, Pages 97-107Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S0968-4328(03)00007-6
Keywords
focused ion beam; redeposition artifact; transmission electron microscope; specimen preparation
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Artifacts associated with transmission electron microscope (TEM) specimens prepared using a focused ion beam (FIB) are not well understood, especially those in non-semiconductor materials. In this paper the extent and origins of artifacts associated with redeposition of milled material in TEM specimens of a FeAl-WC metal matrix composite prepared by FIB were investigated. Cross-sections were prepared normal to an initial FIB cut that allowed direct observation of any damage layers, which are believed to be associated with both redeposition of sputtered material and amorphisation of the surface of the specimen by the ion beam. Techniques for the minimisation of redeposition using either final cleaning mills at low accelerating voltages or plasma cleaning were also investigated and found to be ineffective in removing or reducing these damaged layers. TEM cross-sections of specimens treated using low energy mills and plasma cleaning, further confirmed that these techniques did little to reduce any redeposited or amorphous material. (C) 2003 Elsevier Science Ltd. All rights reserved.
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