A basic study on the behavior of slurry action at multi-wire saw

The workpiece descent type multi-wire saw uses a slicer to dice silicon wafers. This slicing method uses a cutting fluid mixed with abrasive grains, which is called as slurry. The slurry is applied on the wire tool to be carried into the processing area. Therefore, the adhesion conditions and the action of the slurry affect the slicing characteristics. In this project, the relation between the slurry action and the slicing characteristics was studied. The processing mechanism of a multi-wire saw with a descending workpiece was investigated.