Journal
SCRIPTA MATERIALIA
Volume 49, Issue 9, Pages 813-818Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S1359-6462(03)00486-X
Keywords
Pb-free solder; Ni(P); Sn(Cu) alloys
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The formation of Ni3P layers in Sn(Cu)/Ni(P) reaction couples were limited compared to Sn/Ni(P). The sluggish growth of the Ni3P layer was Attributed to a Cu-Sn compound layer formed on the Ni(P) substrate, and it depended on the Ni diffusion in the Cu-Sn compound. (C) 2003 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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