Journal
CARBON
Volume 41, Issue 13, Pages 2459-2469Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/S0008-6223(03)00247-1
Keywords
carbon black; thermal analysis; thermal conductivity
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Carbon black dispersions based on polyethylene glycol (PEG) or di(ethylene glycol) butyl ether, along with dissolved ethyl cellulose, provide thermal pastes that are superior to solder as thermal interface materials. The thermal contact conductance of the interface between copper disks reaches 3 x 10(5) W/m(2) degreesC, compared to 2 x 10(5) W/m(2) T for a tin-lead-antimony solder. The pastes based on PEG are superior to those based on butyl ether in their thermal stability above 100 degreesC. Carbon black is superior to materials that are more conductive thermally (graphite, diamond and nickel particles. and carbon filaments) in providing thermal pastes of high performance. The performance of thermal pastes and solder as thermal interface materials is mainly governed by their conformability and spreadability rather than their thermal conductivity. (C) 2003 Elsevier Ltd. All rights reserved.
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