New low-cost insulation particleboards from mixture of durian peel and coconut coir

The main purpose of this study is to develop low thermal conductivity particleboards with optimized durian peel and coconut coir mixture ratio. To this end, two main parameters were investigated, namely, the mixture ratio of durian peel and coconut coir (by weight) and board density. The particleboards were prepared following common manufacturing technique. It was observed the mixture ratio and board density affect the properties of final particleboards considerably. The optimum mixture ratio of durian peel and coconut coir is 10:90 (by weight), respectively, with a board density of 856 kg/m(3). The corresponding board properties are as follows: thermal conductivity of 0.1342 W/m K, modulus of rupture (MOR) of 440.46 kgf /cm(2), modulus of elasticity (MOE) of 21, 867 kgf/cm(2), internal bond of 37.25 kgf/cm(2), 10.49% thickness swelling, and 6.22% moisture content. Comparison with durian or coconut-based particleboards confirmed that the particleboards manufactured using a mixture of them have better properties, except the modulus of elastic (MOE), which is decreased. The new particleboards have a lower thermal conductivity, that is extremely interesting for energy saving when used as ceiling and wall insulating material. Additionally, these particleboards could be used to produce furniture, that is an additional advantage to help, and manage agriculture waste. (C) 2003 Published by Elsevier Ltd.