Journal
CARBON
Volume 61, Issue -, Pages 342-348Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.carbon.2013.05.014
Keywords
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Funding
- EU
- SSF program Scalable Nanomaterials and Solution Processable Thermoelectric Generators [EM11-0002]
- Chinese Ministry for Science and Technology [2010DFA14450]
- Shanghai Science and Technology Program [12JC1403900]
- NSFC [51272153]
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Graphene of different layer numbers was fabricated using thermal chemical vapor deposition (TCVD), and it was demonstrated as a heat spreader in electronic packaging. Platinum thermal evaluation chips were used to evaluate the thermal performance of the graphene heat spreaders. The temperature of a hot spot driven at a heat flux of up to 430 W cm(-2) was decreased from 121 degrees C to 108 degrees C (Delta T approximate to 13 degrees C) with the insertion of the monolayer graphene heat spreader, compared with the multilayer (n = 6-10) ones' temperature drop of similar to 8 degrees C. Various parameters affecting the thermal performance of graphene heat spreaders were discussed, e.g. layer numbers of graphene, phonon scattering, thermal boundary resistance. We demonstrate the potentials of using a complementary metal oxide semiconductor compatible TCVD process to utilize graphene as a heat spreader for heat dissipation purposes. (C) 2013 Elsevier Ltd. All rights reserved.
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