Integrating nanowires with substrates using directed assembly and nanoscale soldering

This paper describes a new methodology for integrating nanowires with micropatterned substrates using directed assembly and nanoscale soldering. Nanowires containing ferro-magnetic nickel segments were fabricated by electrodeposition in nanoporous membranes. The nanowires were released by dissolution of the membrane and subsequently aligned relative to micropatterned substrates using magnetic field-directed assembly. After assembly, the wires were permanently bonded to the substrates using solder reflow to form low-resistance electrical contacts. This is the first demonstration of the use of nanoscale solder reflow to form low-resistance electrical interconnects between nanowires and substrates, and we demonstrated the utility of the strategy by fabricating a nanowire-based functional analog integrator.