Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 38, Issue 12, Pages 2398-2403Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2007.08.012
Keywords
metal-matrix composites (MMCs); particle-reinforcement; interface/interphase; thermal properties
Ask authors/readers for more resources
In order to dissipate the heat generated in electronic packages, suitable materials must be developed as heat spreaders or heat sinks. Metal matrix composites (MMCs) offer the possibility to tailor the properties of a metal (Cu) by adding an appropriate reinforcement phase (SiC) to meet the demands for high thermal conductivities in thermal management applications. Copper/SiC composites have been produced by powder metallurgy. Silicon carbide is not stable in copper at the temperature needed for the fabrication of Cu/SiC. The major challenge in development of Cu/SiC is the suppression of this reaction between copper and SiC. Improvements in bonding strength and thermo-physical properties of the composites have been achieved by a vapour deposited molybdenum coating on SiC powders to control the detrimental interfacial reactions. (c) 2007 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available