4.7 Article

Inherent sensing and interfacial evaluation of carbon nanofiber and nanotube/epoxy composites using electrical resistance measurement and micromechanical technique

Journal

COMPOSITES PART B-ENGINEERING
Volume 38, Issue 7-8, Pages 847-861

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.compositesb.2006.12.004

Keywords

inherent sensing; nanocomposites; interfacial properties; wettability; electrical resistivity

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Inherent sensing of load, micro-damage and stress transferring effects were evaluated for carbon nanotube (CNT) and carbon nanofiber (CNF)/epoxy composites (with various added contents) by an electro-micromechanical technique, using the four-point probe method. Carbon black (CB)/epoxy composites, with conventional nanosize material added, were used for the comparison with CNT and CNF composites. Subsequent fracture of the carbon fiber in the dual matrix composites (DNIC) was detected by acoustic emission (AE) and by the change in electrical resistance, Delta R due to electrical contacts of neighboring CNMs. Stress/strain sensing of the nanocomposites was detected by an electro-pullout test under uniform cyclic loading/subsequent unloading. CNT/epoxy composites showed the best sensitivity to fiber fracture, matrix deformation and stress/strain sensing, whereas CB/epoxy composite exhibited poorer sensitivity. From the apparent modulus (as a result of matrix modulus and interfacial adhesion), the stress transferring effects reinforced by CNT was highest among three CNMs. The thermodynamic work of adhesion, W-a as found by dynamic contact angle measurements of the CNT/epoxy composite as a function of added CNT content was correlated and found to be consistent with the apparent mechanical modulus. Uniform dispersion and interfacial adhesion appear to be key factors for improving both sensing and mechanical performance of nanocomposite. Thermally treated-CNF composites exhibited a slightly higher apparent modulus, whereas higher testing temperatures appeared to lower the apparent modulus. (c) 2007 Elsevier Ltd. All rights reserved.

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