Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 154, Issue 2, Pages D88-D90Publisher
ELECTROCHEMICAL SOC INC
DOI: 10.1149/1.2402990
Keywords
-
Ask authors/readers for more resources
Co-Ni-Cu/Cu multilayer films form one of the most promising electrodeposited systems for giant magnetoresistance applications. We have studied the surface roughness of Co-Ni-Cu/Cu multilayers with different total thickness and different layer thicknesses systematically by ex situ atomic force microscopy. Films for which the Cu deposition potential was -0.4 or -0.5 V relative to a saturated calomel reference electrode were significantly smoother than films for which the deposition potential was -0.2 V when the total film thickness was less than about 300 nm. For films grown on deliberately roughened substrates, a critical thickness at which the roughness changed from being substrate-dominated to being growth-dominated was identified. (c) 2006 The Electrochemical Society.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available