Journal
WORLD JOURNAL OF ENGINEERING
Volume 8, Issue 2, Pages 151-157Publisher
EMERALD GROUP PUBLISHING LTD
DOI: 10.1260/1708-5284.8.2.151
Keywords
Bonding; Multilayer reactive foil; Chemical reaction; Simulation; Heat transfer
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Funding
- Louisiana State University FRG program
- EDA scholarship
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Nanostructured reactive foils have attracted a great deal of interest recently due to their unique mechanical and thermal properties. Reactive thin foil can be used as a controllable, localized heating source for joining applications, which enable soldering and brazing of materials at room temperature. In this paper, multiphysics-based numerical simulations were performed to simulate reactive thin foils. The conductive heat transfer equation and mass diffusion equations were solved for 1D, 2D, and 3D cases. 1D simulation examined the effect of the chemical reaction rate on the flame speed; 2D simulation gave the detailed temperature and composition distribution in the bi-layers; and 3D simulation demonstrated the localized heating effect of reactive thin foils on a silicon wafer substrate.
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