4.7 Article

Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors

Journal

EXTREME MECHANICS LETTERS
Volume 22, Issue -, Pages 27-35

Publisher

ELSEVIER SCIENCE BV
DOI: 10.1016/j.eml.2018.04.002

Keywords

Transient plane source; Erythema; Sunburn; Thermal conductivity; Epidermal electronics

Funding

  1. Center for Bio-integrated Electronics of the Simpson-Querrey Institute at Northwestern University
  2. Beckman Institute Postdoctoral Fellowship at UIUC
  3. National Science Foundation [DGE-1144245, 1400169, 1534120, 1635443]
  4. National Basic Research Program of China [2015CB351900]
  5. National Natural Science Foundation of China [11402135, 11320101001]
  6. NIH [R01EB019337]
  7. NATIONAL INSTITUTE OF BIOMEDICAL IMAGING AND BIOENGINEERING [R01EB019337] Funding Source: NIH RePORTER

Ask authors/readers for more resources

Noninvasive methods for precise characterization of the thermal properties of soft biological tissues such as the skin can yield vital details about physiological health status including at critical intervals during recovery following skin injury. Here, we introduce quantitative measurement and characterization methods that allow rapid, accurate determination of the thermal conductivity of soft materials using thin, skin-like resistive sensor platforms. Systematic evaluations of skin at eight different locations and of six different synthetic skin-mimicking materials across sensor sizes, measurement times, and surface geometries (planar, highly curvilinear) validate simple scaling laws for data interpretation and parameter extraction. As an example of the possibilities, changes in the thermal properties of skin (volar forearm) can be monitored during recovery from exposure to ultraviolet radiation (sunburn) and to stressors associated with localized heating and cooling. More generally, the results described here facilitate rapid, non-invasive thermal measurements on broad classes of biological and non-biological soft materials. (c) 2018 The Authors. Published by Elsevier Ltd.

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