Journal
COMPOSITES COMMUNICATIONS
Volume 10, Issue -, Pages 103-109Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.coco.2018.08.002
Keywords
Boron nitride; Thermal conductivity; Polymeric composite; Dimension
Categories
Funding
- National Natural Science Foundation of China (NSFC) [21603096, 21503130]
- Natural Science Foundation of Jiangsu Province of China [BK20160618]
- Fundamental Research Funds for the Central Universities [021314380044]
Ask authors/readers for more resources
The demand for insulating polymeric composites with high thermal conductivity has increased remarkably for electronic packaging. Since polymers usually suffer from low thermal conductivity, boron nitrides (BN) are emerging as advanced fillers in polymeric composites. BN nanomaterials strikingly reinforce thermal conductivity of polymers and simultaneously improve insulation, thermal expansion, and dielectricity. We herein introduce diverse BN nanomaterials and summarize the progress about thermal conductive composites with various BN fillers from 0D BN particles via 1D nanotubes to 2D nanosheets. 3D fillers, multi-scale and multidimensional mixed BN fillers developed recently are also presented. The functionalization and the controlled orientation of fillers are reviewed, and current challenges towards higher thermal conductivity of BN/polymer composites are additionally discussed.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available