4.2 Article

New steps for advancing the Nothing On Insulator Triode 3nm gap and preliminary expanded technology

Journal

Publisher

EDITURA ACAD ROMANE

Keywords

Microelectronics; Electronic Packaging; Nanotechnology; Simulations

Funding

  1. Romanian National Authority for Scientific Research and Innovation, CNCS/CCCDI UEFISCDI [PN-III-P4-ID-PCE-2016-0480, PCE 4/2017]

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This paper presents new steps of the Nothing On Insulator (NOI) device advancing. From the simulations point of view, a better swing is accomplished by shorter vacuum gap and the transistor replacement by triode. The actual simulated NOI-Triode with 3nm gap possesses lower swing versus the previous NOI-Triode of 14nm gap. Functional simulations prove the current density vectors from Source to Drain with substantial Gate leakage current. Comparisons with similar vacuum nanotransistors of other authors reveal similar I-D-V-DS and I-D-V-GS curves, with superior currents for the actual NOI-Triode 3nm gap. A preliminary technology, based on laser ablation by MALDI technique, produced a gap of 10 mu m in ABS-conductor micro-wires deposited on glass substrate. An accurate NOI architecture was accomplished, but at expanded sizes, defined by the laser spot resolution.

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