4.7 Article

Bonding and wetting in non-reactive metal/SiC systems: weak or strong interfaces?

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/S0921-5093(99)00274-9

Keywords

wetting; adhesion; interfaces; reactivity; contact angles; spreading

Ask authors/readers for more resources

Wetting (contact angles) and bonding (work of adhesion) of Ag and binary Ag-Si alloys on basal planes of monocrystalline alpha-SiC are studied by the sessile drop technique under a static atmosphere of purified helium at 1200 degrees C. The analysis of the experimental results allows the role of each component of the alloy on the interfacial energies of the system and on wetting to be determined. The conclusions drawn for the Ag/SiC couple are used to explain wetting and bonding in other metal/SiC systems. (C) 2000 Elsevier Science S.A. All rights reserved.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.7
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available