Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 29, Issue 2, Pages 199-204Publisher
MINERALS METALS MATERIALS SOC
DOI: 10.1007/s11664-000-0142-0
Keywords
spin rinse; megasonic cleaning; particle deformation; particle adhesion and removal
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In order to successfully clean particulate contamination from wafer surfaces, it is necessary to understand the adhesion and deformation between the particles and the substrate in contact. The adhesion and removal mechanisms of deformed submicron particles have not been addressed in many previous studies. Submicron polystyrene latex particles (0.1-0.5 mu m) were deposited on silicon wafers and removed by spin rinse and megasonic cleanings. Particle rolling is identified as the major removal mechanism for the deformed submicron particles from silicon wafers. Megasonics provides larger streaming velocity because of the extremely thin boundary layer resulting in a larger removal force that is capable of achieving complete removal of contamination particles.
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