Journal
IEEE ELECTRON DEVICE LETTERS
Volume 21, Issue 5, Pages 242-244Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/55.841309
Keywords
ballistic transport; MOSFET's; numerical analysis; semiconductor device modeling; silicon on insulator; simulation; tunnel transistors; ultra-large-scale integration
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We have performed numerical modeling of nanoscale dual-gate ballistic n-MOSFET's with ultrathin undoped channel, taking into account the effects of quantum tunneling along the channel and through the gate oxide, The results show that transistors with channel length as small as 8 nm can exhibit either a transconductance up to 4000 mS/mm or gate modulation of current by more than 8 orders of magnitude, depending on the gate oxide thickness. These characteristics make the sub-10-nm devices potentially suitable for logic and memory applications, though their parameters are rather sensitive to size variations.
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