Journal
JOURNAL OF APPLIED ELECTROCHEMISTRY
Volume 30, Issue 11, Pages 1261-1268Publisher
KLUWER ACADEMIC PUBL
DOI: 10.1023/A:1026553712521
Keywords
electrodeposition; electrocrystallization; silver; thiocyanate; TiN substrate
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The electrocrystallization and electrodeposition of silver on TiN substrates in AgNO3 + KSCN solutions were studied by electrochemical methods and scanning electron microscopy. The description of Ag electrocrystallization is given in terms of instantaneous, progressive or mixed nucleation models. The parameters of electrocrystallization were determined and the fractional area covered by silver was estimated. A two-step procedure was used for forming a continuous silver film on a TiN substrate. During the first step, a seed layer was deposited on TiN by applying either high negative potential or cathodic current density in 0.011 M AgNO3 + 2.5 M KSCN solution. The applied cathodic current density was higher than the limiting diffusion current in the solution. During the second step, a bulk silver film was deposited galvanostatically from a 0.22 M AgNO3 + 2.5 M KSCN solution at a cathodic current density lower than the limiting current density.
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