Journal
JOURNAL OF ELECTRONICS MANUFACTURING
Volume 10, Issue 4, Pages 253-261Publisher
WORLD SCIENTIFIC PUBL CO PTE LTD
DOI: 10.1142/S0960313100000320
Keywords
heat sinks; forced convection; model
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An analytical model is presented that predicts the average heat transfer rate for forced convection, air cooled, plate fin heat sinks for use in the design and selection of heat sinks for electronics applications. Using a composite solution based on the limiting cases of fully-developed and developing flow between isothermal parallel plates, the average Nusselt number can be calculated as a function of the heat sink geometry and fluid velocity. The resulting model is applicable for the full range of Reynolds number, 0.1 < Re-b* < 100, and accurately predicts the experimental results to within an RMS difference of 2.1%.
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